| PART |
Description |
Maker |
| DB2130300L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
| DB3X207K |
DB3X207K0L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)
|
Panasonic Battery Group
|
| 0674901230 67490-1230 |
1.27mm (.050) Pitch Serial ATA Header, Standard Type, Surface Mount, Right Angle 7 Circuits, with Mylar, Gold (Au) Flash, Embossed Tape on Reel Package, Lead-free
|
Molex Electronics Ltd.
|
| 0674901235 67490-1235 |
1.27mm (.050) Pitch Serial ATA Header, Standard Type, Surface Mount, Right Angle7 Circuits, with Mylar, 0.38μm (15μ) Gold (Au) Plating, Embossed Tape on ReelPackage, Lead-free
|
Molex Electronics Ltd.
|
| LX1810 LX1810-CDB LX1810CDB |
ThermoElectric Cooler Drive Controller IC
Thermo Electric Controller IC
|
外设及接
MICROSEMI[Microsemi Corporation]
|
| LMK212ABJ106KGHT |
Standard packaging quantity (minimum) Taping Embossed 3000pcs
|
Taiyo Yuden (U.S.A.), I...
|
| HMK316AC7225ML-TE |
Standard packaging quantity (minimum) Taping Embossed 2000pcs
|
Taiyo Yuden (U.S.A.), I...
|
| 67492-1632 0674921632 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height4.45mm (.175"), 0.38渭m (15渭") Gold (Au) Plating, with Cap,Embossed Tape on ReelP
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height4.45mm (.175), 0.38μm (15μ) Gold (Au) Plating, with Cap,Embossed Tape on ReelPackaging, 22 Circuits, Lead Free
|
Molex Electronics Ltd.
|
| 55091-0574 0550910574 |
0.635mm (.025) Pitch SlimStack Header, Surface Mount, Dual Row, VerticalCircuits, Robotic Placement Metal Cap, with Embossed Tape on Reel Packaging
|
Molex Electronics Ltd.
|
| 0791098406 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
|
